PHOTOCURABLE RESIN COMPOSITION FOR IMPRINT LITHOGRAPHY AND METHOD FOR MANUFACTURING AN IMPRINT MOLD USING SAME

摘要

The present invention relates to a photocurable resin composition for imprint lithography for forming patterns of various sizes on a substrate, and to a method for manufacturing an imprint mold using same. The photocurable resin composition has superior adhesive properties, and thus can be applied to a variety of materials such as plastic, metal, glass, etc. The photocurable resin composition not only has excellent contamination resistance, but also controls the surface energy of a mold to exhibit superior releasing properties for enabling the mold to be easily released from the substrate. The photocurable resin composition of the present invention has excellent crosslinkability, and thus exhibits non-swelling properties when exposed to an organic solvent. The photocurable resin composition of the present invention has superior mechanical properties, and high restoring force and permeability, and thus can be effectively used in manufacturing a mold for imprint lithography.