METHOD FOR LAMINATING PREPREG, METHOD FOR PRODUCING PRINTED WIRING BOARD AND PREPREG ROLL

摘要

PURPOSE: A prepreg lamination method and a print circuit board manufacturing method and a roll of prepreg are provided to obtain print circuit board corresponded to thinning under the high productivity. CONSTITUTION: The prepreg lamination method includes: preparing the roll(100) of the prepreg; the second resin layer(3) facing the circuit of the circuit board and putting the support base film adhesion prepreg on the top of the circuit board; vacuum laminating the circuit board phase by heating and pressurizing through the heat resistant rubber from the support base film(4) of the support base film adhesion prepreg(10); smoothing the first rinse layer(2) surface.