| 摘要 |
<p>41The invention is aimed at providing a liquid resin composition capable of densely containing a filler and of filling up a narrow gap in a flip-chip-bonded semiconductor device, and ahighly-reliable semiconductor device using the same. The liquid resin composition of the present invention contains (A) an epoxy resin; (B) an epoxy resin curing agent; and (C) a filler, wherein content of (C) the filler is 60% by weight or more and 80% by weight or less of the whole liquid resin composition, and contact angle (Θ) of the liquid resin composition, measured at 110°C in accordance with JIS R3257, is 30° or smaller.No Figure</p> |
