| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition that make possible to form a film-like adhesive that satisfies all, with high level including adhesion properties to a semiconductor wafer, wafer buck face grindability, and properties for embedding at flip-chip bonding. SOLUTION: The adhesive composition includes (A) a thermoplastic resin, having a weight average molecular weight of not less than 20,000 and not larger than 100,000; (B) an epoxy resin; (C) a radiation polymerizable compound; (D) a photo initiator; and (E) a microcapsule-type hardening agent. A film-like adhesive that satisfies all with high level, including adhesion property to a semiconductor wafer (A), wafer back surface grindability, and property for embedding at the flip chip is formed by having the composition. COPYRIGHT: (C)2011,JPO&INPIT |
