| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless-plating apparatus for a small component, which can form a thick plated film of high quality on the surface of the small component. SOLUTION: The electroless-plating apparatus for the small component, which electroless-plates an article 10 to be plated by immersing the article 10 to be plated in a plating liquid 2 contained in a plating tank 1, includes: a plated-article supporting means 3 provided with a plurality of suspension means 11 which suspend a plurality of the articles 10 to be plated that are to be electroless-plated so that the articles 10 can freely rotate and freely move in such a range as not to collide with each other; a driving means 4 for rotating the plated-article supporting means 3 in the plating liquid 2 while conducting electroless plating treatment for the article 10 to be plated that has been immersed in the plating liquid 2 together with the plated-article supporting means 3; a controlling means which controls the temperature of the plating liquid so as to be kept at a predetermined temperature during the electroless plating treatment for the article 10 to be plated; and a means for taking out the plated-article supporting means 3 from the plating liquid 2 and collecting the article to be plated, after a plated layer having a predetermined thickness has been formed on the surface of the article 10 to be plated. COPYRIGHT: (C)2011,JPO&INPIT |
