发明名称 |
MOLD-RELEASING FILM AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE |
摘要 |
Provided is a release film for producing a light emitting diode having desired concaves and convexes accurately transferred directly to the surface of a resin-sealed portion, at a low cost and in high yield, and a process for producing a light emitting diode.A release film 10 having a plurality of convex portions (convex stripes 12) and/or concave portions (grooves 14) formed on the surface is used as a release film to be placed in a cavity of a mold for forming a resin-sealed portion to seal a light emitting element of a light emitting diode.Fig. 1 |
申请公布号 |
SG172062(A1) |
申请公布日期 |
2011.07.28 |
申请号 |
SG20110042215 |
申请日期 |
2010.01.07 |
申请人 |
ASAHI GLASS COMPANY, LIMITED |
发明人 |
HIGUCHI, YOSHIAKI;YUKAWA, YASUMASA |
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