WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board having an alignment mark capable of easy recognition, a method for manufacturing the board, and a semiconductor package wherein various electronic components such as a semiconductor chip and a chip capacitor are mounted on the wiring board.

SOLUTION: The wiring board includes an insulating layer and the alignment mark formed inside of a recess formed on a surface of the insulating layer, wherein one face of the alignment mark is roughened and is exposed at a position recessed from the surface of the insulating layer.

COPYRIGHT: (C)2011,JPO&INPIT