| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of improving the efficiency of heating a substrate, and a method for manufacturing a semi-conductor light emitting element by the sputtering apparatus. <P>SOLUTION: The sputtering apparatus 1 includes: a chamber 10 which is maintained in an evacuated state therein and forms the plasma discharge 20; a cathode 22 which is installed in the chamber 10 to hold a target 21; and a substrate holder 60 for holding the substrate 110, which holds the substrate 110 so that one surface of the substrate 110 is opposite to the surface of the target 21. The substrate 110 is arranged above the sputtering apparatus 1 with the surface of the substrate 110 being directed downward. The target 21 is disposed below the sputtering apparatus 1 with the surface of the target 21 being directed upward. The sputtering apparatus 1 has a heater 65 for heating the substrate 110. The temperature of the substrate 110 is raised by absorbing electromagnetic wave to be emitted from the heater 65. <P>COPYRIGHT: (C)2011,JPO&INPIT |
