| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a MEMS device, which prevents a movable part from sticking to a glass substrate in anodic bonding, suppresses the manufacturing costs, and prevents a bonding failure, and to provide the MEMS device. <P>SOLUTION: The method for manufacturing the MEMS device includes the steps of: forming a fixed part and the movable part positioned inside or outside the fixed part in a semiconductor substrate; arranging a conductive member within a region positioned on the periphery of the movable part when opposed to the semiconductor substrate on one surface of the glass substrate; and performing anodic bonding of the semiconductor substrate and the glass substrate by applying voltage between the semiconductor substrate and the conductive member while the other surface of the glass substrate is opposed to the movable part. <P>COPYRIGHT: (C)2011,JPO&INPIT |
