| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric component that has a superior level of molding pressure resistance and has its height reduced. <P>SOLUTION: The piezoelectric component includes: a piezoelectric substrate 2; piezoelectric devices 3 formed on a principle surface 2a of the piezoelectric substrate 2; a device wiring section; a terminal electrode 6; an insulating film formed on an upper surface of the wiring section; a rewiring layer that is formed on an upper surface of the protective film and that is connected to a wiring section of an electrode; a buffer layer that is composed of an inorganic material and that covers an entire upper surface of the rewiring layer excluding the piezoelectric devices 3; an outer periphery wall 4 that is composed of a photosensitive resin film and is formed on an upper surface of the buffer layer; a first ceiling layer 5a that is composed of a photosensitive resin film having a mica filler added thereto and is formed on an upper surface of the outer periphery wall; a mesh-shaped member 8 that is composed of an insulating material and is installed on an upper surface of the first ceiling layer; a second ceiling layer 5b that is formed so as to cover an upper surface of the mesh-shaped member 8; and through electrodes 7 that are formed so as to pass through the first and second ceiling layers 5a and 5b, the outer periphery wall 4, and the mesh-shaped member 8. Between the outer periphery wall 4, the first ceiling layer 5a, and the principle surface 2a of the piezoelectric substrate 2, there is formed a hollow section C that accommodates the piezoelectric devices 3. <P>COPYRIGHT: (C)2011,JPO&INPIT |
