| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple patterning substrate, which is capable of reducing a possibility of occurrence of cracking. SOLUTION: In the multiple patterning substrate 1, a plurality of substrate regions 2a to 2o to be taken out as substrates are formed, wherein a heating body 6 is provided for the substrate regions 2a to 2o and gaps 3 are formed at peripheral sides of the substrate regions 2a to 2o except for one side. Consequently, generation of thermal stress between a part where the heating body 6 is provided and a part where the heating body 6 is not provided is suppressed. As a result, the possibility of occurrence of cracking in the substrate 1 can be reduced. COPYRIGHT: (C)2011,JPO&INPIT
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