| 发明名称 |
ELECTROLESS DEPOSITIONS FROM NON-AQUEOUS SOLUTIONS |
| 摘要 |
<p>A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.</p> |
| 申请公布号 |
SG171838(A1) |
申请公布日期 |
2011.07.28 |
| 申请号 |
SG20110038544 |
申请日期 |
2009.12.10 |
| 申请人 |
LAM RESEARCH CORPORATION |
发明人 |
NORKUS, EUGENIJUS;JACIAUSKIENE, JANE;DORDI, YEZDI |
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