| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a leadframe, along with a method of manufacturing the same, a semiconductor device, and a method of manufacturing the semiconductor device, capable of reducing a thickness of the semiconductor device without degrading a handling property of the leadframe. <P>SOLUTION: The leadframe 10 includes a die pad 11 having a placing surface 11a on which a semiconductor element 21 is placed, and a lead 12 provided around the die pad 11. The placing surface 11a of the die pad 11 is formed with a placing recess 14 constituted by a first recess 15 with a shallow depth and a second recess 16 located in the center of the first recess 15 and having a deeper depth. Because the semiconductor element 21 can be placed within the placing recess 14, the thickness of the semiconductor device 20 can be reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT |
