| 摘要 |
PROBLEM TO BE SOLVED: To secure cooling reliability and maintainability and to suppress the device height while achieving improvement in function and performance by adopting a front and rear suction and exhaust system for a cooling air flow, in an electronic device that has a plurality of circuit board units respectively mounted with semiconductor elements, a plurality of cooling units and power supply units for the circuit board units, and allows them to be inserted/extracted from the outside. SOLUTION: An electronic device has the following structure. Power supply units are arranged on both sides of the rear surface of the electronic device. As for the horizontal width of each circuit board unit, a level difference is provided between the front and the rear so as to separate a cooling air flow path in the circuit board units and the power supply units while maximally securing a mounting area of the power supply units. COPYRIGHT: (C)2011,JPO&INPIT
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