发明名称 |
MULTILAYER POLYIMIDE FILM AND FLEXIBLE METAL-CLAD LAMINATE USING THE SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer polyimide film which can secure high adhesion of a cover-lay film with adhesive or resist, and a flexible metal-clad laminate using the same. <P>SOLUTION: The multilayer polyimide film includes a thermoplastic polyimide layer provided on at least one side of a non-thermoplastic polyimide layer. The multilayer polyimide film can be attained by a production method of a multilayer polyimide film in which the thermoplastic polyimide layer is composed of a specific aromatic diamine and a specific aromatic acid dianhydride, and is obtained by imidizing a polyamide acid solution having both terminal amino groups obtained by a specific process. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
申请公布号 |
JP2011143678(A) |
申请公布日期 |
2011.07.28 |
申请号 |
JP20100008295 |
申请日期 |
2010.01.18 |
申请人 |
KANEKA CORP |
发明人 |
MATSUTANI AKIO;KONDO YASUTAKA;FUJIMOTO SHOGO;MATSUKUBO SHINJI;KANESHIRO NAGAYASU |
分类号 |
B32B27/34;B32B15/088;B32B37/15;C08G73/10;H05K1/03 |
主分类号 |
B32B27/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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