发明名称 MULTILAYER POLYIMIDE FILM AND FLEXIBLE METAL-CLAD LAMINATE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer polyimide film which can secure high adhesion of a cover-lay film with adhesive or resist, and a flexible metal-clad laminate using the same. <P>SOLUTION: The multilayer polyimide film includes a thermoplastic polyimide layer provided on at least one side of a non-thermoplastic polyimide layer. The multilayer polyimide film can be attained by a production method of a multilayer polyimide film in which the thermoplastic polyimide layer is composed of a specific aromatic diamine and a specific aromatic acid dianhydride, and is obtained by imidizing a polyamide acid solution having both terminal amino groups obtained by a specific process. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011143678(A) 申请公布日期 2011.07.28
申请号 JP20100008295 申请日期 2010.01.18
申请人 KANEKA CORP 发明人 MATSUTANI AKIO;KONDO YASUTAKA;FUJIMOTO SHOGO;MATSUKUBO SHINJI;KANESHIRO NAGAYASU
分类号 B32B27/34;B32B15/088;B32B37/15;C08G73/10;H05K1/03 主分类号 B32B27/34
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