PIEZOELECTRIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To inexpensively manufacture a piezoelectric component that has a superior level of molding pressure resistance while reducing the height and size thereof.

SOLUTION: The piezoelectric component includes: a piezoelectric substrate 2; a comb electrode 3 formed on a main surface of the piezoelectric substrate; an insulation layer 8 formed on upper surfaces of the comb electrode and a wiring electrode disposed adjacent to the comb electrode; a rewiring layer 9 formed on an upper surface of the insulation layer; a protective film layer that is composed of an inorganic material and that covers the entire surface of the rewiring layer excluding the comb electrode from the upper surface of the rewiring layer; an outer periphery wall section 4 formed by laminating a photosensitive resin film to which is added a nano filler onto the protective film layer; a ceiling section 5 formed by laminating the photosensitive resin film to which is added a nano filler or a mica filler onto top openings of the outer periphery wall section 4; and electrode posts 6 formed so as to pass through the outer periphery wall section and the ceiling section. The photosensitive resin film added with a nano filler is formed from a photosensitive resin to which the nano filler composed of an inorganic material with a mean particle size of 1.0 nm or less is added, and has an elastic modulus of 3.0 GPa or greater.

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