发明名称 CYANATE RESIN COMPOSITION, PREPREG, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cyanate resin composition that is excellent in light shielding properties while maintaining a high glass transition temperature and excellent soldering heat resistance, and a prepreg, a laminated board, a resin sheet, a printed wiring board, and a semiconductor device using the resin composition. SOLUTION: The cyanate resin composition includes a cyanate resin and a fluorescent dye compound represented by formula (1) as indispensable components, wherein R<SP>1</SP>and R<SP>2</SP>are each hydrogen or a substituent selected from the group consisting of hydroxy, ethyl, methyl, butyl, tertiary butyl, phenyl, and carboxy, and R<SP>1</SP>and R<SP>2</SP>may be the same or different from each other. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011144229(A) 申请公布日期 2011.07.28
申请号 JP20100004533 申请日期 2010.01.13
申请人 SUMITOMO BAKELITE CO LTD 发明人 TOBISAWA AKIHIKO;UMENO KUNIHARU
分类号 C08L79/04;B32B15/08;C08J5/24;C08K5/3445;H05K1/03 主分类号 C08L79/04
代理机构 代理人
主权项
地址