| 摘要 |
<P>PROBLEM TO BE SOLVED: To provided a bonding structure of a bonding wire, which is adapted to solve the problems of conventional technologies in practical applications of a multiple layer copper bonding wire for improving formation performance and bonding performance of a ball section, and to enhance the bonding strength of wedge connection, while attaining superior industrial productivity, and to provide a method of forming such a bonding structure. <P>SOLUTION: The bonding wire contains copper as the main component, and a highly concentrated layer having a high concentration of electrically conductive metal other than copper is formed in a ball bonding section. The high concentration layer is formed in the vicinity of the surface of the ball boding section, or on a boundary face of the ball bonding section. The thickness of a region which contains an electrically conductive metal concentration of 0.05 to 20 mol% is, preferably, 0.1 μm or more, and the electrically conductive metal concentration in the highly concentrated layer is preferably five or more times the average concentration of the electrically conductive metal in the ball bonding section other than the highly concentrated layer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
