| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a low-cost semiconductor device with a reduced size of a relay board. <P>SOLUTION: The semiconductor device includes a first semiconductor chip 111 formed with a first semiconductor element having a plurality of element electrodes 113, and a first substrate 101 mounted with the first semiconductor chip 111 on an element mounting surface 101A. The first substrate 101 includes a plurality of first electrodes 104 and a plurality of first wires connected to the first electrodes 104 formed on the element mounting surface 101A, a plurality of second electrodes 107 and a plurality of second wires connected to the second electrodes 107 formed on a surface 111B reverse to the element mounting surface 111A, and a plurality of through wires 109 penetrating through the first substrate 101 and connecting the first wires to the second wires. A first side of the first substrate 101 is shorter than a first side of the first semiconductor chip 111. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
