| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting structure for an electronic component that can secure an excellent conductive connection state by eliminating a defect in contact between electrodes during mounting, improve production efficiency, and is reducible in cost. <P>SOLUTION: The mounting structure for the electronic component 121 is constituted by mounting the electronic component 121 having a bump electrode 12 on a substrate 111 having a terminal 11. The bump electrode 12 has a core 13 made of insulating resin, and a conductive film 14 provided on a surface of the core 13, and has the conductive film 14 brought into direct conductive contact with the terminal 11 by elastic deformation. A holding member 23, formed of the same material as the core 13 and holding the state where the bump electrode 12 comes into conductive contact with the terminal 11 by elastic deformation, is provided between the substrate 111 and electronic component 121. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
