发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.
申请公布号 US2011180908(A1) 申请公布日期 2011.07.28
申请号 US20100895126 申请日期 2010.09.30
申请人 IBIDEN CO., LTD 发明人 NAGANUMA NOBUYUKI;TAKAHASHI MICHIMASA;AOYAMA MASAKAZU
分类号 H01L29/41;H01L21/36 主分类号 H01L29/41
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