发明名称 CIRCUIT BOARD, CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a circuit board that secures an excellent conductive connection state by eliminating a contact failure between terminals during connection, makes pitches of the terminals fine and saves the space of a printed board, and enables parts as contacts between the terminals to be easily determined, and to provide a connection structure and a method of manufacturing the connection structure. SOLUTION: The circuit board includes a base substrate 30 and first terminals 40 provided on the base substrate 30 and having a multi-stage shape comprising three or more stages, and the first terminals 40 each include a first stage 41 which is disposed on the base substrate 30, a second stage 42 which is disposed on the first stage 41 and has a smaller area than the first stage 41 in plan view, and a third stage 43 which is disposed on the second stage 42 and has a smaller area than the second stage 42 in plan view. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011146500(A) 申请公布日期 2011.07.28
申请号 JP20100005649 申请日期 2010.01.14
申请人 SEIKO EPSON CORP 发明人 SATO NAOYA
分类号 H05K1/11;H05K1/14;H05K3/36 主分类号 H05K1/11
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