MOUNTED BODY PRODUCTION METHOD AND MOUNTING DEVICE

摘要

In order to produce a mounted body with a high degree of connection reliability, a layering step in which a solder is disposed upon the surface of at least either the electrode of a substrate or the electrode of an electronic component, and in which the substrate, an insulated adhesion layer, and the electronic component are layered in that order; a pressing step in which the electrode of the electronic component and the electrode of the substrate are brought into contact through the insulated adhesion layer by pressing the electronic component to the substrate; a thermal curing step in which the insulated adhesion layer is thermally cured by heating the insulated adhesion layer to a first temperature; and a metallic bonding step in which a metallic bonding layer comprising the solder is formed between the electrode of the substrate and the electrode of the electronic component by heating the solder to a second temperature, are provided.