发明名称 ENCAPSULANT LAYER FOR PHOTOVOLTAIC MODULE, PHOTOVOLTAIC MODULE AND METHOD FOR MANUFACTURING REGENERATED PHOTOVOLTAIC CELL AND REGENERATED TRANSPARENT FRONT FACE SUBSTRATE
摘要 An encapsulant layer for a photovoltaic module enabling recovering and recycling or reusing of reutilizeable resources such as a transparent front face substrate and photovoltaic cell and the like among constituents of a photovoltaic module, and a method for manufacturing a regenerated photovoltaic cell and a regenerated transparent front face substrate. The photovoltaic module is formed by laminating: a transparent front face substrate; a photovoltaic cell carrying a wiring electrode and a takeoff electrode, and an encapsulant layer is placed on at least one surface; and a rear face protecting sheet. The encapsulant layer is a separable layer formed mainly of a thermoplastic resin, and an output maintenance factor of photoelectronic power of the photovoltaic module using the encapsulant layer is in a range of 80% to 100%.
申请公布号 US2011183442(A1) 申请公布日期 2011.07.28
申请号 US201113071781 申请日期 2011.03.25
申请人 DAI NIPPON PRINTING CO., LTD. 发明人 OI KASUMI;MIYACHI TAKAKI;INOUE ISAO;OHKAWA KOUJIRO;NAKAGAWA HIROKI
分类号 H01L31/18;B09B3/00;C08F210/02;C08F230/08;C09D123/08;C09D183/04;H01L25/00;H01L31/02;H01L31/0203;H01L31/04;H01L31/042 主分类号 H01L31/18
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