COOLING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a cooling device improved in cooling performance for cooling heating elements mounted on the lower side of a central part of a vibration plate of a piezoelectric fan in a casing and reducing the size of a device body. SOLUTION: In the inside of the casing 30, air is heated with the heat generated by the heating elements 50, 51 and warm air is generated above each of the heating elements 50, 51. A fixed end of the vibration plate 111 of the piezoelectric fan 101 is fixed to a circuit board P2 at a position where an antinode H2 of the vibration plate 111 other than a free end lies above the heating element 50 and the antinode H1 of the free end of the vibration plate 111 lies above the heating element 51 so that the width direction of the vibration plate 111 becomes vertical to the respective upper faces of the heating element 50 and the heating element 51. When the piezoelectric fan 101 is driven, each of the antinodes H1, H2 at two places of the vibration plate 111 oscillates above each of the heating element 50 and the heating element 51. With this, air flows AF1, AF2are generated for diffusing the warm air above each of the heating elements 50, 51 and the heating element 50 and the heating element 51 are cooled at once. COPYRIGHT: (C)2011,JPO&INPIT