| 摘要 |
Disclosed herein is a method for transferring die from a wafer that includes picking two or more die from a wafer using a multi-spindle picking head, wherein the multi-spindle picking head is rotatable. The method includes moving the multi-spindle picking head from the wafer feeder to a placement machine, and presenting the two or more picked die to the placement machine for subsequent placement. Further disclosed herein is an apparatus for transferring die from a wafer that includes a picking head with a plurality of spindles. Each spindle is configured to pick a die from a wafer of die. The multi-spindle picking head is rotatable and moveable in at least one direction.
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