| 摘要 |
A method for laminating a prepreg contributing to decrease in layer thickness and having high productivity, a method for producing a printed wiring board by the method for laminating the prepreg, and a prepreg roll used for the method for laminating the prepreg are provided. The method involves: 1) preparing a prepreg roll comprising a prepreg comprising at least a core layer, a first resin layer, a second resin layer, being thicker than the first resin layer, and a supporting base film which covers the first resin layer, wherein the prepreg with the supporting base film is rolled up into a roll; 2) unreeling the prepreg with the supporting base film from the prepreg roll, peeling off the peelable film if the second resin layer is covered with the peelable film, and layering the prepreg with the supporting base film on a circuit board so that the second resin layer side of the prepreg with the supporting base film faces a circuit of the circuit board; 3) vacuum laminating the prepreg; and 4) smoothing a surface of the first resin layer contacting the supporting base film by hot press. |
