ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD

摘要

Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A surface-roughened copper foil, which is obtained by roughening at least one face of a base copper foil (untreated copper foil) so as to increase the surface roughness (Rz) thereof, relative to the surface roughness (Rz) of said base copper foil, by 0.05-0.3 µm and has a roughened surface with a surface roughness (Rz) after roughening of 1.1 µm or less, wherein said roughened surface comprises roughed grains in a sharp-pointed convex shape which have a width of 0.3-0.8 µm, a height of 0.4-1.8 µm and an aspect ratio [height/width] of 1.2-3.5.