发明名称 |
CERIUM OXIDE ABRASIVE AND SLURRY CONTAINING THE SAME |
摘要 |
<p>Disclosed are a cerium oxide abrasive for selectively polishing various SiO<SUB>2 </SUB>films and SiO<SUB>2</SUB>-Si<SUB>3</SUB>N<SUB>4 </SUB>films; and a slurry containing the same. The cerium oxide abrasive and the polishing slurry of the present invention have a high polishing rate and are also free from microscratches in a polished surface upon polishing since polycrystalline cerium oxide having a mean crystalline particle size of 5 nm or less is synthesized by using hexagonal cerium carbonate having a hexagonal crystal structure as a raw material of cerium.</p> |
申请公布号 |
EP1756244(B1) |
申请公布日期 |
2011.07.27 |
申请号 |
EP20060715744 |
申请日期 |
2006.01.24 |
申请人 |
LG CHEM, LTD. |
发明人 |
NHO, JUN-SEOK;OH, MYOUNG-HWAN;KIM, JANG-YUL;CHO, SEUNG-BEOM;KIM,JONG-PIL |
分类号 |
C09K3/14;B24B37/00;B82Y10/00;B82Y30/00;B82Y99/00;C01F17/00;H01L21/304 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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