发明名称 |
ELECTRONIC MODULE ASSEMBLY WITH HEAT SPREADER |
摘要 |
An electronic module assembly including a first substrate; a first semiconductor die mounted to a top surface of the first substrate; a second substrate located above the first semiconductor die and electrically and mechanically connected to the top surface of the first substrate; a second semiconductor die mounted to a top surface of the second substrate; a heat spreader located above the second semiconductor die and thermally coupled to the second semiconductor die; and encapsulant material at least partially surrounding the second semiconductor die and the heat spreader. |
申请公布号 |
EP1894237(A4) |
申请公布日期 |
2011.07.27 |
申请号 |
EP20060765471 |
申请日期 |
2006.06.07 |
申请人 |
NOKIA CORPORATION |
发明人 |
HENELL, ANNA-MARIA;KYYHKYNEN, VESA, T.;NURMINEN, JANNE, T. |
分类号 |
H01L23/433;H01L25/065;H01L25/10 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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