| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame for use in a semiconductor device comprising a semiconductor chip, wherein the semiconductor device which can efficiently radiate heat generating from the semiconductor chip is provided at a low cost. <P>SOLUTION: The lead frame comprises a metal thin plate in which a stage 5 for arranging a semiconductor chip 3 and a plurality of leads 7 arranged surrounding the stage 5 are integrally formed, and a thickness dimension of the stage 5 is longer than that of the lead 7. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
