INTERCONNECTION STRUCTURE, INTERPOSER, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING INTERCONNECTION STRUCTURE

摘要

PURPOSE: An interconnection structure, an interposer, a semiconductor package, and a method for manufacturing the interconnection structure are provided to simply manufacture a cavity and a lateral part by an etching process, thereby reducing manufacturing costs. CONSTITUTION: An interposer(130) comprises a substrate part and an electrode pattern part. The substrate part comprises a plurality of lateral parts and a plurality of cavities. The cavities are formed between the lateral parts. The electrode pattern part is formed on the surfaces of the lateral parts and the cavities. The surfaces of the cavities are horizontal to the surfaces of the lateral parts. The electrode pattern part electrically connects a circuit board(110) with a semiconductor chip(120).