| 摘要 |
PURPOSE: An LED package and a manufacturing method thereof are provided to form a substrate by a printing or coating method with a conductor and an insulator, thereby enhancing bonding strength without a gap between the substrate and an LED. CONSTITUTION: A first conductive layer(120) is formed on a LED patterning layer. An insulating layer(130) buries the first conductive layer on the LED patterning layer. A second conductive layer is formed on the outside of an insulating layer. A third conductive layer(150) is formed in the insulating layer to electrically connect the first and second conductive layers. The insulating layer comprises a filler, a resin, a dispersing agent, and an additive. The filler comprises a fluorescent substance.
|
