发明名称 METHOD FOR MANUFACTURING METAL LAMINATED SUBSTRATE FOR SEMICONDUCTOR ELEMENT FORMATION AND METAL LAMINATED SUBSTRATE FOR SEMICONDUCTOR ELEMENT FORMATION
摘要 Disclosed is a metal laminated substrate for forming an epitaxial growth film for forming a semiconductor element having high biaxial crystal orientation on a surface of a metal substrate and a method of manufacturing the metal laminated substrate. The manufacturing method includes the steps of activating at least one surface of a metal plate T1 by sputter etching or the like; activating at least one surface of a metal foil T2 made of Cu or a Cu alloy which is cold-rolled at a rolling reduction of 90% or more; laminating the metal plate and the metal foil such that an activated surface of the metal plate and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the metal plate and the metal foil which are laminated to each other at a rolling reduction of 10% or less, for example; and biaxially orienting crystals of the metal foil by heat treatment at a temperature of not lower than 150°C and not higher than 1000°C.
申请公布号 KR20110086024(A) 申请公布日期 2011.07.27
申请号 KR20117010374 申请日期 2009.10.20
申请人 TOYO KOHAN CO., LTD. 发明人 OKAYAMA HIRONAO;KANEKO AKIRA;NANBU KOUJI
分类号 H01L21/20;B21B47/00 主分类号 H01L21/20
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