Thermopile infrared sensor in monolithic silicium microstructure

摘要

The sensor has a thermopile-sensor structure comprising thermal elements e.g. thermopile or bolometer, that are arranged on connection rods (6), where the rods connect hot contacts (9) on an absorber layer (5) with cold contacts (8) of the thermal elements. A membrane (3) is suspended over the connection rods, and has slots on both sides of the thermal elements. The slots separate the connection rods from a central area (4) and a heat-conducting frame-shaped supporting body (2), where the central area is covered by the absorber layer. The sensor structure is made from poly-silicon.