| 摘要 |
<p>The present invention relates to a microcapsule-conductive particle complex comprising a conductive particle consisting of conductive metallic particle or polymer particle coated on a surface with a conductive metallic layer; a microcapsule being adsorbed by the conductive particle or adsorbing the conductive particle, comprising a core and a shell, wherein the core contains organic compound which is a curing agent for a fast curing at a low temperature and the shell has a surface functional group with affinity for metal of the conductive metallic layer on its surface, a preparation method thereof and an anisotropic conductive film (ACF) using the same.</p> |
