| 摘要 |
<p>In a wafer ( 1 ) with a number of exposure fields ( 2 ), each of which exposure fields comprises a number of lattice fields ( 3 ) with an IC ( 4 ) located therein, two groups ( 5, 7 ) of saw paths ( 6, 8 ) are provided and two control module fields (A 1 , A 2 , B 1 , B 2 , C 1 , C 2 , D 1 , D 2 ) are assigned to each exposure field, each of which control module fields contains at least one optical control module (OCM-A 1 , OCM-A 2 , OCM-B 1 , OCM-B 2 , OCM-C 1 , OCM-C 2 , OCM-D 1 , OCM-D 2 ) and lies within the exposure field in question and comprises a plurality of control module field sections (A 11 , A 12 . . . AIN and A 21 , A 22 . . . A 2 N and B 11 , B 12 . . . B 1 N and B 21 , B 22 . . . B 2 N and C 1 N and C 2 N and D 1 N and D 2 N) and is distributed among several lattice grids ( 3 ), wherein each control module field section (A 11 to D 2 N) is located in a lattice field and contains at least one control module component ( 10,11,12,13,14,15,16,17,18 ).</p> |
