发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 <p>PURPOSE: A light emitting diode package is provided to form a parallel circuit between a static electricity protecting device and light emitting diodes by wire bonding, thereby protecting the light emitting diodes from static electricity. CONSTITUTION: A first conductive base(120) is arranged in a lead frame cup(110). A second conductive base(130) is separated from the first conductive base. A first lead frame(140) and a second lead frame(150) are formed on the outside of the lead frame cup. A light emitting diode(160) is arranged on the first conduction base or the second conduction base. A static electricity protecting device(170) is formed on one of the first conductive base and the second conductive base.</p>
申请公布号 KR20110085742(A) 申请公布日期 2011.07.27
申请号 KR20100005689 申请日期 2010.01.21
申请人 ILJIN SEMICONDUCTOR CO., LTD. 发明人 KIM, JAE HYEOK;KWON, SOON MOK;KIM, GEUN HO;KIM HACHUL
分类号 H01L33/62;H01L27/04 主分类号 H01L33/62
代理机构 代理人
主权项
地址
您可能感兴趣的专利