<p>PURPOSE: A light emitting diode package is provided to form a parallel circuit between a static electricity protecting device and light emitting diodes by wire bonding, thereby protecting the light emitting diodes from static electricity. CONSTITUTION: A first conductive base(120) is arranged in a lead frame cup(110). A second conductive base(130) is separated from the first conductive base. A first lead frame(140) and a second lead frame(150) are formed on the outside of the lead frame cup. A light emitting diode(160) is arranged on the first conduction base or the second conduction base. A static electricity protecting device(170) is formed on one of the first conductive base and the second conductive base.</p>
申请公布号
KR20110085742(A)
申请公布日期
2011.07.27
申请号
KR20100005689
申请日期
2010.01.21
申请人
ILJIN SEMICONDUCTOR CO., LTD.
发明人
KIM, JAE HYEOK;KWON, SOON MOK;KIM, GEUN HO;KIM HACHUL