| 发明名称 |
WAFER PROCESSING TAPE |
| 摘要 |
<p>A wafer-processing tape (10), having an intermediate resin layer (2), a removable adhesive layer (3), and, if necessary, an adhesive layer (4), which are laminated in this order on a substrate film (1), wherein a storage elastic modulus at 80°C of the intermediate resin layer is larger than a storage elastic modulus at 80°C of the removable adhesive layer.</p> |
| 申请公布号 |
EP1775760(A4) |
申请公布日期 |
2011.07.27 |
| 申请号 |
EP20050768338 |
申请日期 |
2005.08.02 |
| 申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
KITA, KENJI;MORISHIMA, YASUMASA;ISHIWATA, SHINICHI;YABUKI, AKIRA |
| 分类号 |
H01L21/301;C09J7/02;H01L21/52 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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