| 摘要 |
A heat-dissipating device comprises a metallic layer (2) to contact a heat source (6), and a layered functional unit formed on the metallic layer (2) and including a semiconductor material and a far infrared material. Preferably, the functional unit further includes a carbon material having a large specific surface area. The heat from the metallic layer (6) excites the electrons in the semiconductor material to jump across band gap and then release heat energy, and excites the far infrared material to radiate far infrared rays. A rapid heat dissipation rate can be achieved by increasing heat transfer area and by converting heat into far infrared rays that can be radiated away rapidly.
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