| 摘要 |
PURPOSE: A molding apparatus for a semiconductor device and a method thereof are provided to individually operate upper/lower fixing pins with a separate controller, thereby making the molding thicknesses of the upper and lower parts of a semiconductor chip equal. CONSTITUTION: A main hydraulic cylinder(170) is placed on both sides of a base(110). A pair of templates(120a,120b) face each other. A pair of molds(130a,130b) face each other inside the templates. Sub elevation blocks(140a,140b) are vertically operated by a sub hydraulic cylinder. An elevation block(150) is vertically elevated by the main hydraulic cylinder.
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