发明名称 |
COMPOSITE SUBSTRATE FOR A SEMICONDUCTOR CHIP |
摘要 |
A composite substrate for a semiconductor chip includes a first covering layer containing a semiconductor material, a second covering layer, and a core layer arranged between the first covering layer and the second covering layer, wherein the core layer has a greater coefficient of thermal expansion than the covering layers. |
申请公布号 |
EP2347434(A1) |
申请公布日期 |
2011.07.27 |
申请号 |
EP20090767931 |
申请日期 |
2009.11.09 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
MOOSBURGER, JUERGEN;STAUSS, PETER;PLOESSL, ANDREAS |
分类号 |
H01L21/02;H01L21/20 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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