发明名称 |
Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin |
摘要 |
An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
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申请公布号 |
US7985822(B2) |
申请公布日期 |
2011.07.26 |
申请号 |
US20050661095 |
申请日期 |
2005.08.31 |
申请人 |
DAINIPPON INK AND CHEMICALS, INC. |
发明人 |
OGURA ICHIRO;TAKAHASHI YOSHIYUKI;ARITA KAZUO;MORINAGA KUNIHIRO;SATOU YUTAKA |
分类号 |
C08G59/00 |
主分类号 |
C08G59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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