| 摘要 |
PURPOSE: A surface acoustic wave filter package is provided to form a surface acoustic wave filter package by only one green sheet, thereby saving production costs. CONSTITUTION: A protection film(123) is formed on a surface acoustic wave filter chip(120). The protection film is formed on a part except for a bump ball or a solder ball(121) corresponding to a terminal. A green sheet(110) comprises a bonding surface and a terminal surface. The bonding surface includes a bonding pattern(111) contacting a terminal of the surface acoustic wave filter chip. A terminal pattern(115) is electrically connected to the bonding pattern on the terminal surface. |
