发明名称 |
Integrated circuit package system with interconnect lock |
摘要 |
An integrated circuit package system includes: mounting a device structure over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock over the internal interconnect over the device structure with interconnect lock exposing the device structure; and forming a package encapsulation adjacent to the interconnect lock and over the package carrier. |
申请公布号 |
US7985628(B2) |
申请公布日期 |
2011.07.26 |
申请号 |
US20070954607 |
申请日期 |
2007.12.12 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
KUAN HEAP HOE;CHOW SENG GUAN;CHUA LINDA PEI EE;MERILO DIOSCORO A. |
分类号 |
H01L21/332 |
主分类号 |
H01L21/332 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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