发明名称 |
Integrated circuit package on package system |
摘要 |
An integrated circuit package on package system including forming an interconnect integrated circuit package and attaching an extended-lead integrated circuit package on the interconnect integrated circuit package wherein a mold cap of the extended-lead integrated circuit package faces a mold cap of the interconnect integrated circuit package.
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申请公布号 |
US7986043(B2) |
申请公布日期 |
2011.07.26 |
申请号 |
US20060276646 |
申请日期 |
2006.03.08 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
MERILO DIOSCORO A.;CHOW SENG GUAN;DIMAANO, JR. ANTONIO B.;KUAN HEAP HOE;HO TSZ YIN |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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