METHOD OF FORMING A SEMICONDUCTOR DIE

摘要

PURPOSE: A method for forming a semiconductor die is provided to form a short mutual connection unit, thereby minimizing parasitic resistance and inductance in the connection unit. CONSTITUTION: A semiconductor wafer(30) has an upper surface and a bottom surface. A plurality of semiconductor dies is formed on the semiconductor wafer. An irregular shape is singulated using a singulation line(31) which is expanded in an axial direction. A singulation area is formed as a semiconductor wafer area between the semiconductor dies. The semiconductor dies are simultaneously singulated by dry-etching.