发明名称 Method of manufacturing light emitting device
摘要 A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process steps, without enclosing a drying agent. The present invention has a top surface emission structure. A substrate on which the light emitting elements are formed is bonded to a transparent sealing substrate. The structure is one in which a transparent second sealing material covers the entire surface of a pixel region when bonding the two substrates, and a first sealing material (having a higher viscosity than the second sealing material), which contains a gap material (filler, fine particles, or the like) for protecting a gap between the two substrates, surrounds the pixel region. The two substrates are sealed by the first sealing material and the second sealing material. Further, reaction between electrodes of the light emitting elements (cathodes or anodes) and the sealing materials can be prevented by covering the electrodes with a transparent protective layer, for example, CaF2, MgF2, or BaF2.
申请公布号 US7985606(B2) 申请公布日期 2011.07.26
申请号 US20100726429 申请日期 2010.03.18
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 NISHI TAKESHI;NAKAMURA YASUO
分类号 H01L21/00;H05B33/04;H01L21/54;H01L21/56;H01L27/32;H01L51/50;H01L51/52;H05B33/10;H05B33/26 主分类号 H01L21/00
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