发明名称 |
SYSTEM AND METHOD FOR PRODUCTION OF SEMICONDUCTOR PACKAGE |
摘要 |
PURPOSE: A system and method for manufacturing a semiconductor package are provided to cut an individual grid array after arraying a laminating film and a metal plating film in a grid shape, thereby increasing production. CONSTITUTION: A semiconductor chip is mounted on an opening of a substrate in which a plurality of grid arrays is placed(S520). A film is laminated to cover all the grid arrays(S530). A boundary line between the grid arrays is grooved in the film(S540). Metal is plated on the film(S550). Each grid array is cut(S560).
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申请公布号 |
KR20110084695(A) |
申请公布日期 |
2011.07.26 |
申请号 |
KR20100004388 |
申请日期 |
2010.01.18 |
申请人 |
WISOL CO., LTD. |
发明人 |
KIM, MYEONG KEE;JANG, SUK HWAN |
分类号 |
H01L23/043;H01L21/52;H01L21/78;H01L23/28 |
主分类号 |
H01L23/043 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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