| 摘要 |
<p>PURPOSE: A light emitting diode and a method of manufacturing the same are provided to radiate heat without an additional radiation plate by using three thermal conductive layers as a radiation plate. CONSTITUTION: A conductive layer is formed on top of an insulating substrate. A thermal conductive layer radiating heat is formed on the bottom of the insulating layer. An upper substrate(10) having an opening between an upper conducive layer for an anode electrode and a lower conductive layer for a cathode electrode is provided. A lower substrate(20) having upper and lower conductive layers which radiate heat is formed on the top and the bottom of the insulating layer. The upper and lower substrates are bonded to each other through a bonding layer. A light emitting diode chip(33) is mounted on the bonding layer of the upper substrate. An N-type pad and P-type pad of the light emitting diode chip are wire-bonded with the upper conductive layer.</p> |
